At present, smartphones generally implement stacked packaging (PoP) of processors SoC and memory (DRAM). According to the information released by AMD recently, PC products are expected to achieve similar technology.
At Rice Oil & Gas High Performance Computing Conference, Forrest Norrod, senior vice president of AMD, said that they were following up on 3D packaging technology, aiming to integrate DRAM / SRAM (cache, etc.) and processor (CPU / GPU) into a chip through TSV (silicon perforation).
In fact, AMD has taken the lead in introducing HBM display and memory products, realizing the integration and packaging of GPU chip and display and memory chip, but that only belongs to the 2.5D scheme.
The advantage of 3D stacking is that it shortens the current transfer path, that is, it reduces power consumption. However, the challenge of 3D packaging is how to control fever.
Unfortunately, AMD has not released any more technical details.
AMD said that although the lithography process is improving, but the frequency even began to decline, need some new design assistance.
In fact, Intel this year also announced a 3-D chip packaging technology called Foveros, which integrates 22-nm I/O substrate, 10-nm Sunny Core and four-core Atom with a power consumption of only 7 watts.