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2019

04/12

Ministry of Industry and Information Technology: Semiconductor design level in China has reached 7Nm technology level to be improved

In the global semiconductor industry, the United States is still the strongest. American companies account for 68% of the global wafer-free semiconductor industry, and remain invincible for nine years. The manufacturing process is also the most advanced, while South Korea is strong in the field of memory chips and OEM. China has made rapid progress in the field of semiconductors. In 2018, China's sales of integrated circuit industry reached 653.2 billion yuan, with a compound growth rate of 20.3%. The semiconductor design level of domestic companies has reached 7 nm level, and the manufacturing of semiconductors is about to produce 14 nm process. However, there is still a big gap with the advanced level of foreign countries.

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Recently, at the National Symposium on the work of electronic information industry in 2019, Ren Aiguang, Director of Integrated Circuits Department, Electronic Information Department, Ministry of Industry and Information Technology, introduced the progress of domestic semiconductor industry. In 2018, the sales volume of China's integrated circuit industry was 653.2 billion yuan, and the compound growth rate was 20.3% from 2012 to 2018.

Among the output value of 653.2 billion yuan, the sales revenue of integrated circuit design industry increased from 35% in 2012 to 38%. The revenue of semiconductor manufacturing industry increased from 23% to 28%. The revenue of semiconductor sealing industry decreased from 42% in 2012 to 34%. Ren Aiguang said that the industrial structure of integrated circuits in China was becoming more and more optimized.

In the three industrial chains of semiconductor design, manufacturing and sealing, sealing and testing are relatively low-end, and the output value is the lowest. Design and manufacturing are more important. The high proportion of sealing and testing indicates that the semiconductor industry structure is relatively low-end. At present, the sealing and testing work of American semiconductors has almost been transferred to overseas factories, firmly grasping the two key links of design and manufacturing.

Although the output value and development speed of integrated circuits in China are very good, Ren Aiguang also mentioned that integrated circuits in China still need to be further strengthened in the three areas of design, manufacturing and sealing. Ren Aiguang pointed out that the domestic semiconductor design industry has been growing, and the advanced design level has reached 7Nm level, but still mainly in the middle and low end.

In IC manufacturing, the technology of memory chip is about to make a breakthrough, and the 14-nm logic process is about to be mass-produced, but there are still two generations gap with foreign countries.

In IC sealing industry, the gap between domestic level and foreign level is the smallest, and the proportion of high-end sealing business has reached 30%, but the industrial concentration still needs to be further improved.