TSMC is the world's first large-scale production of 7-nm process Foundry, of course, TSMC also regards 7-nm as another long-term process node after 28-nm. However, in the face of the demand of mainland customers for Taiwan's advanced production capacity, with a lot of uncertainties, Taiwan's Chief Executive Wei Zhejia expressed on the mainland station of the annual user conference that he was both afraid and happy.
It is understood that Taiji has increased its capacity by 2% this year, all of which have been put into 7-nm nodes, thus reaching an annual capacity of 1 million pieces at 7-nm. Controlling machine, process development and quality control is the hard currency of Taiji's long-term absolute advantage in leading the wafer manufacturing market. 7Nm + is the first time to introduce EUV lithography technology into large-scale production, and 5nm will be introduced into EUV in February next year to start a risk trial production, and then fill the 6nm gap, thereby prolonging the life cycle of 7nm.
First make 7nm, then push to 5nm, and then back to tap the potential of both process nodes to launch 6nm OEM service. In this regard, Wei Zhe's explanation is that the Roadmap implementation benefits from the thorough mastery of EUV technology by Taiji, which combines 7-nm and 5-nm technologies, thus enabling the connecting link between 6-nm (it is said that 6-nm logic density has increased by 18% compared with 7-nm), providing users with a better cost-effective choice of OEM process, which is a consideration for Taiji to reduce costs for customers and achieve win-win results with customers.
In 2020, the production of 6nm will be mainly aimed at the existing 7Nm customers to provide more options, especially for those who can not afford 5nm price code, to meet the mobile, consumer applications, AI, 5G infrastructure, GPU and high-performance computing needs. Because of the low interoperability between 5nm and 7Nm processes, 6nm and 7Nm are the responsibility of Sinopec, while the 5G and AI markets with high growth are locked in. Tainan Fab18 is the undertaker of 5nm mass production in February next year.
In addition to continually advancing process miniaturization nodes, aiming at AI's desire for computing power, CoWoS existed eight years ago, InFO appeared three years ago, and Intel also introduced its Foveros wafer-level packaging technology, which seems to combine the implementation of high-performance devices with heterogeneous packaging technology, thus reducing the design and manufacturing pressure of single-chip SoC. The organic combination of the front and back processes is one of the key skills for wafer manufacturers, especially Foundry manufacturers of advanced processes, to win in the AI era.
Wei Zhejia said that the trust of users, enough capacity of Taiji and fully leading technology are the three key factors for Taiji to succeed. For the coming 5G, IoT, edge computing, AI and other popular applications, semiconductor is indispensable, with a total of 1300 design engineers and 10,000 ecological engineering partners, as always in the IC industry innovation, cooperation and efforts! Target Requirements: Customers will not ask the second question when they know that they are in Taiji.